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3D打印的技術(shù)分類
1、SLA（StereoLithography，光固化成型技術(shù)）
指利用紫外光照射液態(tài)光敏樹脂發(fā)生聚合反應(yīng)，逐層固化并生成三維實(shí)體。SLA制造的工件尺寸精度高，是商業(yè)化較早的3D打印技術(shù)。
2、CLIP（ContinuousLiquid Interface Production Technology，連續(xù)液體界面提取技術(shù)）
是Carbon 3D公司在SLA技術(shù)的基礎(chǔ)上開發(fā)的具有革命性的3D打印技術(shù)，將3D打印的速度提高了100倍。CLIP從底部投影，使光敏樹脂固化，未固化的部分通過(guò)控制氧氣形成死區(qū)，抑制光固化反應(yīng)而保持穩(wěn)定的液態(tài)區(qū)域，保證了固化的連續(xù)性。
3、3DP（Three-DimensionalPrinting，三維打印快速成型技術(shù)）
與傳統(tǒng)二維噴墨打印接近，從噴頭噴出粘結(jié)劑（彩色粘結(jié)劑可以打印出彩色制件），將平臺(tái)上的粉末粘結(jié)成型，通常采用石膏粉作為成型材料。3DP技術(shù)目前主要有兩項(xiàng)應(yīng)用：全彩3D打印和砂模鑄造。
4、PJ（Poly Jet，聚合物噴射技術(shù)）
其成型原理類似3DP技術(shù)，但噴射的不是粘合劑而是光固化樹脂，噴射完成后通過(guò)紫外光照射固化成型。Poly Jet采用陣列式噴頭，甚至可以同時(shí)噴射不同材料，實(shí)現(xiàn)多種材料、多色材料同時(shí)打印。
5、FDM（FusedDeb Modeling，熔融層積技術(shù)）
利用高溫將材料熔化，通過(guò)打印頭擠出成細(xì)絲，在構(gòu)件平臺(tái)上堆積成型。FDM是最簡(jiǎn)單也是最常見的3D打印技術(shù)，通常應(yīng)用于桌面級(jí)3D打印設(shè)備。
6、NPJ（NanoParticle Jetting，納米顆粒噴射打印技術(shù)）
這是金屬3D打印成型技術(shù)，使用納米液態(tài)金屬以噴墨的方式沉積成型，打印速度比普通激光打印快5倍，且具有優(yōu)異的精度和表面粗糙度。
7、SLM（SelectiveLaser Melting，選區(qū)激光熔化成型技術(shù)）
是目前金屬3D打印成型中最普遍應(yīng)用的技術(shù)，采用精細(xì)聚焦光斑快速熔化預(yù)置金屬粉末，直接獲得任意形狀以及具有完全冶金結(jié)合的零件，制件致密度可達(dá)99%以上。
8、SLS（SelectiveLaser Sintering，選區(qū)激光燒結(jié)成型技術(shù)）
與SLM技術(shù)類似，區(qū)別是激光功率不同，通常用于高分子聚合物的3D打印成型。SLS也可用于制造金屬或陶瓷零件，制件致密度低，且需要經(jīng)過(guò)后期致密化處理才能使用。
9、LMD（LaserMetal Deb，激光熔覆成型技術(shù)）
該技術(shù)名稱繁多，常用名稱包括：LENS、DMD、DLF、LRF等。與SLM最大不同在于，其粉末通過(guò)噴嘴聚集到工作臺(tái)面，與激光匯于一點(diǎn)，粉末熔化冷卻后獲得堆積的熔覆實(shí)體。
10、EBM（ElectronBeam Melting，電子束熔化技術(shù)）
其工藝過(guò)程與SLM非常相似，區(qū)別在于，EBM所使用的能量源為電子束。EBM的電子束輸出能量通常比SLM的激光輸出功率大一個(gè)數(shù)量級(jí)，掃描速度也遠(yuǎn)高于SLM。因此EBM在構(gòu)建過(guò)程中，需要對(duì)造型臺(tái)整體進(jìn)行預(yù)熱，防止成型過(guò)程中溫度過(guò)大帶來(lái)較大的殘余應(yīng)力。
 

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電機(jī)啟動(dòng)器 3VU16403MK00

150-F201NCD SMC Flex Smart Motor Controller

1732D-OB8EM12 ArmorBlock 8 Point Output Block

1771-P10 1771 Power Supply

193-EEAB E1 Plus 0.1-0.5 A IEC Overload Relay

199-GSMA1 500 Line MOV Surge Suppressor

2090-CPWM7DF-08AA12 MP-Series 12m Standard Power Cable

2094-XNINV-1 Kinetix 6000 Connector Set

EDS-305-S-SC-T C1 D2 4-port 10/100, 1 port single-mode SC fiber (-40 to 75 deg C op temp)

GFK-1213 Series 90-30 FIP Bus Controller User's Manual

IC220ACC005 MODULE KEYING TABS QTY 100

IC647BWC000 Batch Opt: WorkInstruction Client Pak

IC647PRTHE100M Proficy Portal Historian Edition Client Pack 100 Users (M4 Key)

IC693CPU370 CPU370 Plus (240K Bytes configurable user memory). Supports EZ Store (IC200ACC003). Requires a high capacity power supply and recommend high capacity battery. Note: The CPU37x CPUs may not work with Horner Electric modules due to the speed of th

IC756ADV000K-99 DV Development - AIX Op Sys, Korean, Version 9.9

MSI-EFF-SV Efficiency Management Server Software

SLC/1746 System 1746-RT27 REPLACEMENT TERMINAL BLOCK - ANALOG OUTPUT

Distributed I/O 1738-IB8M23 24VDC 8 SINKING INPUTS WITH M23 CONNECTOR

Communications

Operator Interface 2711-NL4 BACKLIGHT LAMP PV1000 COLOR (SERIES A ONLY)

Support 9302-REPS SUPT RENEWAL CONTRACT FOR 9302REP