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產(chǎn)品簡介
廣東UHP-0805MC,USP-1515M4批發(fā),玻璃切割uv膜
廣東UHP-0805MC,USP-1515M4批發(fā),玻璃切割uv膜
產(chǎn)品價格:¥電詢
上架日期:2012-08-11 14:35:47
產(chǎn)地:新友維
發(fā)貨地:18925557115
供應(yīng)數(shù)量:不限
最少起訂:1卷
瀏覽量:1457
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詳細說明
    晶圓切割膠帶- Pressure Sensitive Series -
    Part Number :
    F - 90
    T - 80
    T - 120
    GE - 200

    A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.
    High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other b.
    We Toyo Adtec consider needs of each user and choose appropriate tapes.

    Feature
    ● Various product line
    ● standard type (AD series)
    ● high-perbance to difficult-to-adhere workpiece (GD series)
    ● excellent stability against elapsed deterioration (T series)
    ● high-perbance to laser-dicing (F-90)
    ● Easy pick-up with excellent expandability

    Specification
    Recommended Works Part Number Base
    Film Color Thickness (μm) Adhesion Thickness (μm) Adhesive Strength (N/20mm) Probe Tack (N/20mm2) Feature
    Si
    GaAs
    Other Semiconductor F-90MW PO MW 90 10 1 1 PVC-free type
    T-80MW PVC 80 0.8 0.7 Excellent temporal stability
    T-80HW 1.7 1
    T-120HW 120 1.7 1
    Thick Workpiece 20GE-200 LB 200 2.7 2.9 For thick workpiece

    *The above data is just for representing value, and not guaranteed value.
    *Static type is lined up.
    *Color : MW (Milky White) ,LB (Light Blue), T (Transparent)
    *Separator thickness is not included.



    晶圓切割膠帶- UV Series -
    Part Number :
    UDV - 80J / UDV - 100J / UHP - 110B
    UHP - 0805MC / UHP - 1005M3
    UHP - 110M3 / UHP - 1025M3
    UHP - 1510M3 / UHP - 1525M3
    USP - 1515M4 / USP - 1515MG
    UDT - 1025MC / UDT - 1325D
    UDT - 1915MC

    A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.
    High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA are widely used for dicing and singulation of driver ICs, LTCC substrates, EMC package substrates, Si wafers, ceramics, glass, lenses and so on.
    Especially UV series of Elegrip dicing tapes enable strong holding power and easy peeling without glue residue, by deactivating adhesion with UV irradiation. Elegrip dicing tapes can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other b.
    We Toyo Adtec consider needs of each user and choose appropriate tapes.


    Feature
    ● Excellent control to back-side chipping and chip fly-off.
    ● Excellent adhesiveness.
    ● Smooth peeling by UV.
    ● High perbance to EMC (Epoxy Mold Compound) and other types of difficult-to-adhere workpiece.


    Recommended
    Work I Si
    GaAs
    Other Semi conductor
    Part Number UDV-
    80J
    UDV-
    100J
    UHP-
    110B
    UHP-
    0805MC
    UHP-
    1005M3
    UHP-
    110M3

    基材 PVC PO
    顏色 T MW
    總厚度 (μm) 80
    100
    110
    85
    105
    110

    黏著力 (μm) 10 5 10
    Adhesive Strength (N/20mm) 3.8(0.2)
    3.8(0.2)
    2.9(0.2)
    5.0(0.2)
    5.0(0.2)
    7.6(0.2)

    Probe Tack (N/20mm2) 2.1(0.05)
    2.1(0.05)
    2.7(0.05)
    1.7(0.05)
    2.7(0.05)
    3.9(0.05)

    特性 Easy pickup For less chipping For small size chips
    Recommended
    Work II Package
    Part Number UHP-1025M3
    UHP-1510M3
    UHP-1525M3
    USP-1515M4
    USP-1515MG

    基材 PO
    顏色 MW
    總厚度 (μm) 125
    160
    175
    165

    黏著力 (μm) 25
    10
    25
    15
    Adhesive Strength (N/20mm) 12.0(0.2)
    6.5(0.2)
    13.5(0.2)
    14.5(0.2)
    15.0(0.2)

    Probe Tack (N/20mm2) 5.5(0.05)
    4.2(0.05)
    5.6(0.05)
    6.2(0.05)
    5.9(0.05)

    特性 For encapsulated workpiece
    For less backside burrs
    For less glue scratch-up on the chip side walls
    For less against residue onto a making area
    Recommended
    Work III Glass
    Crystal
    Part Number UDT-1025MC
    UDT-1325D
    UDT-1915MC

    基材 PET
    顏色 T
    總厚度 (μm) 125
    155
    203

    黏著力 (μm) 25 15
    Adhesive Strength (N/20mm) 30.0(0.2)
    20.4(0.2)
    20.3(0.2)

    Probe Tack (N/20mm2) 7.5(0.05)
    6.7(0.05)
    5.9(0.05)

    特性 For less backside cracking
    For encapsulated workpiece
    For less backside cracking


    *( ) is adhesive strength after UV.
    *The above data is just for representing value, and not guaranteed value.
    *Static type is lined up.
    *Color : MW (Milky White), T (Transparent)
    *UV irradiate condition : Light volume=above 150mJ/cm2.
    *UV irradiate condition may change with dicing products.
    *Separator thickness is not included.

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